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Volumn 6, Issue , 2011, Pages 2955-2958

Reliability evaluation of FPC under bending stress

Author keywords

finite element analysis; FPC; mechanical performance; von mises stress

Indexed keywords

ANALYSIS RESULTS; BENDING METHODS; BENDING STRESS; CONSTANT STRESS; FINITE ELEMENT ANALYSIS METHOD; FPC; MATERIAL MECHANICS; MECHANICAL PERFORMANCE; MODELING AND SIMULATION; OPTIMIZATION VARIABLES; RELIABILITY EVALUATION; SIMULATION PROCESS; VON MISES STRESS; VON MISES STRESS DISTRIBUTION;

EID: 80053400090     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMEIT.2011.6023667     Document Type: Conference Paper
Times cited : (4)

References (5)
  • 3
    • 35348913554 scopus 로고    scopus 로고
    • Mechanical characterization of microelectronics embedded in flexible and stretchable substrate
    • Wang L, et al. (2006) Mechanical characterization of microelectronics embedded in flexible and stretchable substrate. Proceeding of Electronics Packaging Technology Conference, 766-772
    • (2006) Proceeding of Electronics Packaging Technology Conference , pp. 766-772
    • Wang, L.1
  • 4
    • 33847174247 scopus 로고    scopus 로고
    • Automated modeling and fatigue analysis of flexible printed circuits
    • Ptchelintsev A. (2006) Automated modeling and fatigue analysis of flexible printed circuits. Proceeding of EuroSime 2006, 1-6.
    • (2006) Proceeding of EuroSime 2006 , pp. 1-6
    • Ptchelintsev, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.