3D integration demonstration of a wireless product with design partitioning

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Volumn , Issue , 2011, Pages

  Druais, G ^a   Ancey, P ^a   Aumont, C ^a   Caubet, V ^a   Chapelon, L L ^a   Chaton, C ^b   Cheramy, S ^b   Cordova, S ^c   Cirot, E ^c   Colonna, J P ^b   Coudrain, P ^a   Divel, T ^c   Dodo, Y ^a   Farcy, A ^a   Guitard, N ^a   Haxaire, K ^a   Hotellier, N ^a   Leverd, F ^a   Liou, R ^c   Michailos, J ^a   Ostrovsky, A ^a   Petitdidier, S ^a   Pruvost, J ^a   Riquet, D ^a   Robin, O ^a   Saugier, E ^a   Sillon, N ^b   more..

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c ST Ericsson   (France)

Author keywords

3DIC; copper pillars; partitioning; stacking; TSV

Indexed keywords

3DIC; COPPER PILLARS; PARTITIONING; STACKING; TSV;

INDUSTRIAL APPLICATIONS; INTEGRATION; PRODUCT DESIGN; THREE DIMENSIONAL COMPUTER GRAPHICS;

INTEGRAL EQUATIONS;

EID: 84866839731     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2012.6262962     Document Type: Conference Paper

References (6)

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3. P.Marchal et al, "3D Technology Roadmap and Status", IITC2011.
4. JH.Lau et al, "TSV Manufacturing Yield and Hidden Costs for 3D IC Integration", ECTC2010.
5. G.Druais et al, "TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration", ESTC2010.
6. E.Beyne, B.Swinnen "3D system integration technologies", VLSI2006.