TSV as an alternative to wire bonding for a wireless industrial product: Another step towards 3D integration

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Druais, G ^a   Ancey, P ^a   Chapelon, L L ^a   Charbonnier, J ^b   Cheramy, S ^b   Dodo, Y ^a   Farcy, A ^a   Garnier, G ^b   Guillou, Y ^c   Henry, D ^b   Leduc, P ^b   Pruvost, J ^a   Saugier, E ^a   Sillon, N ^b  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c ST Ericsson   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ASSEMBLY APPROACH; ELECTRICAL MEASUREMENT; INDUSTRIAL DEMANDS; INDUSTRIAL PRODUCT; TECHNOLOGICAL DEVELOPMENT; TEST STRUCTURE; THROUGH SILICON VIAS; WIRE BONDING;

THREE DIMENSIONAL; WIRE;

INTEGRATION;

EID: 78651293065     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642920     Document Type: Conference Paper

References (7)

1. "International Technology Roadmap for Semiconductors (ITRS): 2007 Edition, Semiconductor Industry Association, 2007.
2. E.Beyne, "The rise of the 3rd dimension for system integration", IITC 2006, p.1.
3. A.Klumpp, "3D System Integration", VLSI 2007, p.70
4. Y.Guillou, "Innovation through 3-D integration : opportunities and challenges for a wireless IC company", RTI2009, to be published
5. S.Pozder and al., "Progress of 3D integration technologies and 3D interconnects", IITC2007
6. D.Henry and al., "Through Silicon Vias technology for CMOS image sensors packaging: presentation of technology and electrical results", EPTC2008, p.35.
7. D.Henry et al., "Development and characterization of high electrical performances TSV for 3D applications", EPTC2009