Durability of Pb-free solder connection between copper interconnect wire and crystalline silicon solar cells

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1232-1239

  Cuddalorepatta, Gayatri ^a   Dasgupta, Abhijit ^a   Sealing, Scott ^b   Moyer, Jerome ^c   Tolliver, Todd ^b   Loman, James ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b Global Research Center   (United States)

^c GE ENERGY   (United States)

Author keywords

Energy partitioning fatigue model; Pb Free solder; Photovoltaic cells; Thermal cycling durability; Viscoplastic finite element analysis

Indexed keywords

CRYSTALLINE MATERIALS; ELECTRIC CONTACTS; ELECTRIC WIRE; FINITE ELEMENT METHOD; SILICON; SOLAR CELLS; THERMAL CYCLING; VISCOPLASTICITY;

ENERGY PARTITIONING FATIGUE MODELS; LEAD- FREE SOLDER; PHYSICS-OF-FAILURE (POF); THERMAL CYCLING DURABILITY; VISCOPLASTIC FINITE ELEMENT ANALYSIS;

SOLDERED JOINTS;

EID: 33845595943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645486     Document Type: Conference Paper

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