Diffusion growth of Cu 3Sn phase in the bump and thin film Cu/Sn structures

Microelectronics Reliability

Volumn 52, Issue 9-10, 2012, Pages 1971-1974

  Dimcic, B ^a,b   Labie, R ^a   De Messemaeker, J ^a   Vanstreels, K ^a   Croes, K ^a   Verlinden, B ^b   De Wolf, I ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION PARAMETERS; FLIP CHIP; GROWTH OF INTERMETALLICS; INTERFACIAL GROWTH; PROCESSING ROUTE; TEMPERATURE RANGE; THICKNESS GROWTH;

INTERMETALLICS;

TIN;

EID: 84866730483     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.06.013     Document Type: Article

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