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Volumn , Issue , 2012, Pages

Electrical characterization of carbon nanotube vertical interconnects with different lengths and widths

Author keywords

[No Author keywords available]

Indexed keywords

TEMPERATURE;

EID: 84866654446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2012.6251578     Document Type: Conference Paper
Times cited : (10)

References (17)
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    • Srivastava, N.1    Banerjee, K.2
  • 6
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    • Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact
    • N. Chiodarelli et al., "Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact," in Proc. of IEEE IITC/MAM, pp. 1-3, 2011.
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    • Chiodarelli, N.1
  • 7
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    • X. Sun et al., "Contact resistances of carbon nanotube via interconnects," in Proc. of IEEE EDSSC, pp. 131-5, 2009.
    • (2009) Proc. of IEEE EDSSC , pp. 131-135
    • Sun, X.1
  • 9
    • 36349032609 scopus 로고    scopus 로고
    • Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
    • S. Sato et al., "Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles," in Proc. of IEEE IITC, pp. 230-2, 2006.
    • (2006) Proc. of IEEE IITC , pp. 230-232
    • Sato, S.1
  • 10
    • 84858980430 scopus 로고    scopus 로고
    • Integrating low temperature aligned carbon nanotubes as vertical interconnects in si technology
    • S. Vollebregt et al., "Integrating low temperature aligned carbon nanotubes as vertical interconnects in si technology," in Proc. of IEEE NANO, pp. 985-90, 2011.
    • (2011) Proc. of IEEE NANO , pp. 985-990
    • Vollebregt, S.1
  • 11
    • 28244463477 scopus 로고    scopus 로고
    • Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells
    • M. Nihei et al., "Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells," in Proc. of IEEE IITC, pp. 234-6, 2005.
    • (2005) Proc. of IEEE IITC , pp. 234-236
    • Nihei, M.1
  • 12
    • 42549150646 scopus 로고    scopus 로고
    • Integration and electrical properties of carbon nanotube array for interconnect applications
    • Y.-M. Choi et al., "Integration and electrical properties of carbon nanotube array for interconnect applications," in Proc. of IEEE NANO, pp. 262-5, 2006.
    • (2006) Proc. of IEEE NANO , pp. 262-265
    • Choi, Y.-M.1
  • 14
    • 81455154328 scopus 로고    scopus 로고
    • Ultra-high density carbon nanotubes on Al-Cu for advanced vias
    • J. Dijon et al., "Ultra-high density carbon nanotubes on Al-Cu for advanced vias," in Proc. of IEEE IEDM, p. 33.4.1, 2010.
    • (2010) Proc. of IEEE IEDM
    • Dijon, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.