-
1
-
-
40349090128
-
Die stacking (3D) microarchitecture
-
B. Bryan, A. Murali, and B. Ned,"Die Stacking (3D) Microarchitecture," in International Symposium on Microarchitecture, 2006, pp. 469-479.
-
(2006)
International Symposium on Microarchitecture
, pp. 469-479
-
-
Bryan, B.1
Murali, A.2
Ned, B.3
-
2
-
-
34547204691
-
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
-
G. L. Loi, B. Agrawal, and N. Srivastava,"A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy," in Design Automation Conference, 2006, pp. 991-996.
-
(2006)
Design Automation Conference
, pp. 991-996
-
-
Loi, G.L.1
Agrawal, B.2
Srivastava, N.3
-
3
-
-
70450243083
-
Hybrid cache architecture with disparate memory technologies
-
W. Xiaoxia, L. Jian, Z. Lixin,"Hybrid Cache Architecture with Disparate MemoryTechnologies," in International Sysmposium on Computer Architecture, 2009, pp 34-45.
-
(2009)
International Sysmposium on Computer Architecture
, pp. 34-45
-
-
Xiaoxia, W.1
Jian, L.2
Lixin, Z.3
-
4
-
-
33847743417
-
A novel nonvolatile memory with spin torque transfer magnetization switching: Spin-ram
-
M. Hosomi, H. Yamagishi, and T. Yamamoto,"A novel nonvolatile memory with spin torque transfer magnetization switching: spin-ram," in International Electron Devices Meeting, 2005, pp. 459-462.
-
(2005)
International Electron Devices Meeting
, pp. 459-462
-
-
Hosomi, M.1
Yamagishi, H.2
Yamamoto, T.3
-
5
-
-
34247864561
-
2Mb spin-transfer torque RAM (SPRAM) with bit-by-bit bidirectional current write and parallelizing-direction current read
-
T. Kawahara, R. Takemura, and K. Miura,"2Mb Spin-Transfer Torque RAM (SPRAM) with Bit-by-Bit Bidirectional Current Write and Parallelizing-Direction Current Read," in IEEE International Solid-State Circuits Conference, 2007, pp. 480-617.
-
(2007)
IEEE International Solid-State Circuits Conference
, pp. 480-617
-
-
Kawahara, T.1
Takemura, R.2
Miura, K.3
-
6
-
-
84892545647
-
Circuit and microarchitecture evaluation of 3D stacking magnetic RAM (MRAM) as a universal memory replacement
-
D. Xiangyu, W. Xiaoxia, L. Helen,"Circuit and Microarchitecture Evaluation of 3D Stacking Magnetic RAM (MRAM) as a Universal Memory Replacement," in Design Automation Conference, 2009, pp 554-559.
-
(2009)
Design Automation Conference
, pp. 554-559
-
-
Xiangyu, D.1
Xiaoxia, W.2
Helen, L.3
-
7
-
-
36049053305
-
Reversible electrical switching phenomena in disordered structures
-
S. R. Ovshinsky,"Reversible Electrical Switching Phenomena in Disordered Structures," Physical Review Letter, Vol. 21, No. 20, 1968, pp. 1450.
-
(1968)
Physical Review Letter
, vol.21
, Issue.20
, pp. 1450
-
-
Ovshinsky, S.R.1
-
8
-
-
0035717521
-
OUM-A 180nm nonvolatile memory cell element technology, for stand alone and embedded applications
-
S. Lai and T. Lowrey,"OUM-A 180nm Nonvolatile Memory Cell Element Technology, For Stand Alone and Embedded Applications," IEDM Tech. Dig., 2001, pp. 803.
-
(2001)
IEDM Tech. Dig.
, pp. 803
-
-
Lai, S.1
Lowrey, T.2
-
9
-
-
40349090128
-
Die stacking (3D) microarchitecture
-
December
-
B. Black, M. Annavaram, E. Brekelbaum, J. DeVale, L. Jiang, G. Loh, D. McCauley, P. Morrow, D. Nelson, D. Pantuso, P. Reed, J. Rupley, S. Shankar, J. Shen, and C. Webb. Die Stacking (3D) Microarchitecture. In Proceedings of MICRO-39, December 2006.
-
(2006)
Proceedings of MICRO-39
-
-
Black, B.1
Annavaram, M.2
Brekelbaum, E.3
Devale, J.4
Jiang, L.5
Loh, G.6
McCauley, D.7
Morrow, P.8
Nelson, D.9
Pantuso, D.10
Reed, P.11
Rupley, J.12
Shankar, S.13
Shen, J.14
Webb, C.15
-
10
-
-
9344233646
-
On-chip MRAM as a high-bandwidth low-latency replacement for DRAM physical memories
-
R. Desikan, C. R. Lefurgy, S. W. Keckler, and D. Burger,"On-chip MRAM as a high-bandwidth low-latency replacement for DRAM physical memories," Tech. Rep., 2002.
-
(2002)
Tech. Rep.
-
-
Desikan, R.1
Lefurgy, C.R.2
Keckler, S.W.3
Burger, D.4
-
11
-
-
84866610520
-
Assessment of MRAM technology characteristics and architectures
-
R. Desikan, S. Keckler, and D. Burger,"Assessment of MRAM technology characteristics and architectures," Tech. Rep., 2002.
-
(2002)
Tech. Rep.
-
-
Desikan, R.1
Keckler, S.2
Burger, D.3
-
13
-
-
34247381686
-
Cache miss behavior: Is it ?2
-
A. Hartstein et al.,"Cache miss behavior: is it ?2," in Proc. Computing frontiers, pp. 313-320, 2006.
-
(2006)
Proc. Computing Frontiers
, pp. 313-320
-
-
Hartstein, A.1
|