Electrodeposition of Ag-Ni films from thiourea complexing solutions

Electrochimica Acta

Volumn 82, Issue , 2012, Pages 82-89

  Liang, Defu ^a   Liu, Zhengwei ^b   Hilty, Robert D ^b   Zangari, Giovanni ^a  

^a University of Virginia   (United States)

^b TE Connectivity   (United States)

Author keywords

Ag Ni alloys; Electrochemical codeposition; Metastable; Microstructures; Thiourea

Indexed keywords

ACIDIC SOLUTIONS; AG-NI ALLOY; AG-NI FILMS; ALLOY FORMATION; AMORPHOUS PHASE; AS-DEPOSITED FILMS; ELECTROCHEMICAL CODEPOSITION; ELECTROCHEMICAL STUDIES; FINE GRAINED; METASTABLE; METASTABLE PHASE; NANOCRYSTALLINES; NI CONTENT; POROUS FILM; SULFUR INCORPORATION; SUPERSATURATED SOLID SOLUTIONS; THERMAL-ANNEALING;

AMORPHOUS FILMS; ELECTRODEPOSITION; GRAIN BOUNDARIES; METASTABLE PHASES; MICROSTRUCTURE; SILVER ALLOYS; THIOUREAS;

SILVER;

EID: 84866430112     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2012.04.100     Document Type: Conference Paper

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