Electrodeposition of mirror-bright silver in cyanide-free bath containing uracil as complexing agent without a separate strike plating process

Journal of the Electrochemical Society

Volumn 156, Issue 3, 2009, Pages

  Xie, Bu Gao ^a   Sun, Jian Jun ^a   Lin, Zhi Bin ^a   Chen, Guo Nan ^a  

^a FUZHOU UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; COPPER; COPPER DEPOSITS; CYANIDES; CYCLIC VOLTAMMETRY; DISKS (MACHINE COMPONENTS); DISKS (STRUCTURAL COMPONENTS); ELECTROCHEMICAL ELECTRODES; ELECTROCHEMICAL PROPERTIES; ELECTROPLATING; GLASS MEMBRANE ELECTRODES; MIRRORS; OXIDE MINERALS; PLATING; POLYETHYLENES; QUARTZ; QUARTZ CRYSTAL MICROBALANCES; ROTATING DISKS; SCANNING ELECTRON MICROSCOPY; SILVER COMPOUNDS; SILVER DEPOSITS; SILVER PLATING;

BASE METALS; COMPLEXING AGENTS; COPPER SUBSTRATES; DIFFERENTIAL CAPACITANCES; DISPLACEMENT RATES; ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCES; GLASSY CARBON ELECTRODES; GRAIN SIZES; PLATING BATHS; PLATING PROCESS; POLYETHYLENE IMINES; ROTATING DISK ELECTRODES; SCANNING ELECTRONS; SILVER COMPLEXES; SILVER SURFACES;

SILVER;

EID: 59349109400     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3046157     Document Type: Article

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