Electrodeposition of metastable Au-Ni alloys

Journal of the Electrochemical Society

Volumn 157, Issue 7, 2010, Pages

  Rouya, E ^a   Stafford, G R ^b   Bertocci, U ^b   Mallett, J J ^a   Schad, R ^c   Begley, M R ^a   Kelly, R G ^a   Reed, M L ^a   Zangari, G ^a  

^a University of Virginia   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c University of Alabama   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY COMPOSITIONS; AS-DEPOSITED ALLOY; AS-DEPOSITED FILMS; ATOMIC VOLUMES; BIPHASIC; DEPOSITION POTENTIAL; ELECTROCHEMICAL PROCESSING; EXCESS FREE ENERGY; GRAIN SIZE; HYDROGEN EVOLUTION REACTIONS; METASTABLE SOLID SOLUTION; METASTABLE STRUCTURES; NANOCRYSTALLINES; NI ALLOYS; NI CONTENT; OVERPOTENTIAL; PARASITIC REACTION; PHASE-SEPARATION PROCESS; SURFACE DIFFUSIVITY; THERMAL-ANNEALING; THERMODYNAMICALLY STABLE;

CERIUM ALLOYS; CRYSTALLIZATION; ELECTRODEPOSITION; FREE ENERGY; GOLD ALLOYS; GOLD DEPOSITS; GOLD PLATING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METASTABLE PHASES; PHASE INTERFACES; PHASE SEPARATION; SOLID SOLUTIONS; SOLIDIFICATION;

NANOCRYSTALLINE ALLOYS;

EID: 77953158113     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3421749     Document Type: Article

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