Significance of electromagnetic coupling through vias in electronics packaging

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 135-138

  Zhao, Jin ^a   Fang, Jiayuan ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC FIELD EFFECTS; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS;

ELECTROMAGNETIC COUPLING;

ELECTRONICS PACKAGING;

EID: 0031378663     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)