Insulating polyimide films containing n-type perylenediimide moieties

Polymer International

Volumn 61, Issue 10, 2012, Pages 1582-1591

  Damaceanu, Mariana Dana ^a   Rusu, Radu Dan ^a   Musteata, Valentina Elena ^a   Bruma, Maria ^a  

^a PETRU PONI INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Romania)

Author keywords

AC conductivity; Dielectric properties; Oxadiazole; Polyperyleneimides; Thin films; XPS

Indexed keywords

AC CONDUCTIVITY; DIANHYDRIDES; DIELECTRIC PERMITTIVITIES; ELECTRONIC CONDUCTION; FLEXIBLE FILMS; FREQUENCY DOMAINS; HEXAFLUOROISOPROPYLIDENE; HIGH TEMPERATURE; HOPPING MECHANISM; IMAGINARY PARTS; INSULATING PROPERTIES; LOW-ACTIVATION ENERGY; OXADIAZOLES; PERYLENEDIIMIDES; PERYLENES; POLYIMIDE FILM; POLYPERYLENEIMIDES; SOLUTION POLYCONDENSATION; SPECIFIC RESISTANCES; STRUCTURE OF THE POLYMERS; SUBGLASS TRANSITION;

ACTIVATION ENERGY; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES; MECHANICAL PROPERTIES; PERMITTIVITY; PHOTOELECTRONS; POLYCYCLIC AROMATIC HYDROCARBONS; POLYIMIDES; POLYMER FILMS; POLYMERIC FILMS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRIC PROPERTIES;

EID: 84866333496     PISSN: 09598103     EISSN: 10970126     Source Type: Journal    
DOI: 10.1002/pi.4253     Document Type: Article

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