Atmospheric dielectric barrier discharge treatments of polyethylene, polypropylene, polystyrene and poly(ethylene terephthalate) for enhanced adhesion

Journal of Adhesion Science and Technology

Volumn 26, Issue 20-21, 2012, Pages 2325-2337

  Dixon, D ^a   Meenan, B J ^a  

^a UNIVERSITY OF ULSTER   (United Kingdom)

Author keywords

contact angle; Corona; Dielectric Barrier Discharge (DBD); peel test; plasma; poly(ethylene terephthalate); polyethylene; polypropylene; polystyrene; XPS

Indexed keywords

ADHESIVE BONDING; ATMOSPHERIC DIELECTRIC BARRIER DISCHARGE; CORONA; CRITICAL ISSUES; CRITICAL REVIEW; DIELECTRIC BARRIER DISCHARGE TREATMENTS; DIELECTRIC BARRIER DISCHARGES; IN-LINE; LOW COST METHODS; LOW MOLECULAR WEIGHT; PACKAGING SECTORS; PEEL TESTS; PRINTING PERFORMANCE; PRINTING PROCESS; SURFACE LAYERS; TREATMENT PROCESS;

ATMOSPHERIC PRESSURE; BONDING; CONTACT ANGLE; DIELECTRIC DEVICES; FLOW CONTROL; PLASMAS; POLYETHYLENES; POLYMERS; POLYPROPYLENES; POLYSTYRENES; PRINTING; SURFACE PROPERTIES; X RAY PHOTOELECTRON SPECTROSCOPY;

POLYETHYLENE TEREPHTHALATES;

EID: 84866108054     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856111X599481     Document Type: Review

References (49)

1. S. Meiners, J. G. H. Salge, E. Prinz and F. Forster, Surface Coatings Technol. 98, 1121-1127(1998).
2. M. J. Owen and P. J. Smith, in: Polymer Surface Modification; Relevance to Adhesion, K. L.Mittal(Ed.), pp. 3-15. VSP Utrecht, The Netherlands (1996).
3. J. Mort and J. Jansen, Plasma Deposited Thin Films. CRC Press, Boca Raton, FL (1986).
4. F. N. Rothacker, US Patent No. 2,864,755 (1958).
5. G. L. Groff and H. M. Bond, US Patent No. 3,116,534 (1964).
6. R. Seebock, H. Esrom, M. Charbonnier and M. Romand, Plasmas Polymers 5, 105-118 (2000).
7. H. E. Wagner, R. Brandenburg, K. V. Kozlov, A. Sonnenfeld and P. Michael, Vacuum 71, 417(2003).
8. N. Cui, D. J. Upadhyay, C. A. Anderson, B. J. Meenan and N. M. D. Brown, Appl. Surface Sci.253, 3865-3871 (2007).
9. J. F. Carley and P. T. Kitze, Polym. Eng. Sci. 18, 326-334 (1978).
10. J. H. Choi, E. S. Lee, H. K. Baik, S. Lee, K. M. Song and Y. K. Lim, Plasma Sources Sci. Technol.14, 363-367 (2005).
11. C. M. Cepeda-Jimenez, R. Torregrosa-Macia and J. M. Martin-Martinez, J. Adhesion Sci. Technol.17, 1145-1159 (2003).
12. S. Okazaki, M. Kogoma, M. Uehara and Y. Kimura, J. Phys. D 26, 889-892 (1993).
13. A. Martinez-Garcia, S. Gilbert-Soler, C. M. Cepeda-Jimenez, R. Torregrosa-Macia and J. M.Martin-Martinez, J. Adhesion Sci. Technol. 21, 441-463 (2007).
14. G. Borcia, N. M. D. Brown, D. Dixon and R. McIlhagger, Surface Coatings Technol. 179, 70-77(2004).
15. D. J. Upadhyay, N. Y. Cui, C. A. Anderson and N. M. D. Brown, Appl. Surface Sci. 229, 352-364,(2004).
16. N. Cui, N. M. D. Brown and B. J. Meenan, Appl. Surface Sci. 252, 2297-2310 (2006).
17. L. A. O'Hare, J. A. Smith, S. R. Leedey, B. Parbhoo, A. J. Goodwin and J. F. Watts, SurfaceInterface Anal. 33, 617-625 (2002).
18. N. Cui, D. J. Upadhyay, C. A. Anderson and N. M. D. Brown, Surface Coatings Technol. 192,94-100 (2005).
19. A. Martinez-Garcia, A. Sanchez-Reche, S. Gisbert-Soler and C. M. Cepeda-Jimenez, J. AdhesionSci. Techol. 17, 47-65 (2003).
20. C. Liu, N. Cui, N. M. D. Brown and B. J. Meenan, Surface Coatings Technol. 185, 311-320(2004).
21. R. N. Wenzel, J. Phys. Chem. 53, 1466-1467 (1949).
22. S. J. Park and J. S. Jin, J. Colloid Interace. Sci. 236, 155-160 (2001).
23. F. M. Etzler, in: Contact Angle, Wettability and Adhesion, Vol. 3, K. L. Mital (Ed.), pp. 215-264.VSP, Utrecht (2003).
24. M. Matsunaga and P. J. Whitney, Polym. Degrad. Stab. 70, 325-332 (2000).
25. M. Pascal, R. Balart, L. Sanchez, O. Fenollar and O. Calvo, J. Mater. Sci. 43, 4901-4909 (2008).
26. M. Pascal, R. Balart, L. Sanchez, O. Fenollar and O. Calvo, J. Adhesion Sci. Technol. 22, 1425-1442 (2008).
27. C. S. Ren, K. Wang, Q. Y. Nie, D. Z. Wang and S. H. Guo, Appl. Surface Sci. 255, 3421-3425(2008).
28. G. Borcia, C. A. Anderson and N. M. D. Brown, Plasma Sources Sci. Technol. 12, 335-344 (2003).
29. S. Masuda, S. Hosokawa, I. Tochizawa, K. Akutsu, K. Kuwano and A. Iwata, IEEE Trans. IndustryApplications 20, 377-381 (1994).
30. R. D. Boyd, A. M. Kenwright, J. P. S. Badyal and D. Briggs, Macromolecules 30, 5429-5436(1997).
31. J. M. Strobel, M. Strobel, C. S. Lyons, C. Dunatov and S. J. Perron, J. Adhesion Sci. Techol. 5119-130 (1991).
32. C. Wang and X. He, Surface Coatings Technol. 201, 3377-3384 (2006).
33. P. Wittenbeck and A. Wokaun, J. Appl. Polym. Sci. 50, 187-200 (2003).
34. O. D. Greenwood, R. D. Boyd, J. Hopkins and J. P. S. Badyal, J. Adhesion Sci. Techol. 9, 311-326(1995).
35. S. Guimond and M. R. Wertheimer, J. Appl. Polym. Sci., 94, 1291-1303 (2004).
36. A. Kaminska, H. Kaczmarek and J. Kowalonek, Eur. Polym. J. 38, 1915-1919 (2002).
37. A. Kuwabara, S. Kuroda and H. Kubota, Plasma Sci. Technol. 9, 181-189 (2007).
38. S. Guimond, I. Radu, G. Czeremuszkin, D. J. Carbson and M. R. Wertheimer, Plasmas Polymers7, 71-88 (2002).
39. F. Leroux, C. Champagne, A. Perwuelz and L. Gengembre, J. Colloid Interface Sci. 328, 412-420(2008).
40. P. Esena, C. Riccard, S. Zanin, M. Totini, G. Poletti and F. Orsini, Surface Coatings Technol. 200,664-667 (2005).
41. F. Leroux, C. Campagne, A. Perwuelz and L. Gengembre, Surface Coatings Technol. 203, 3178-3183 (2009).
42. Z. Fang, J. Lin, H. Yang and Y. Qui, IEEE Trans Plasma Sci., 35, 659-667 (2009).
43. N. De Geyter, R. Morent, C. Leys, L. Gengembre, E. Paye, S. Van Vlierberghe and E. Schacht,Surface Coatings Technol. 202, 3000-3010 (2008).
44. T. G. Van Kooten, H. T. Spijker and H. J. Busscher, Biomaterials 25, 1735-1747 (2004).
45. J. Ramsey, R. Rhazi and A. Garnier, J. Fermentation Bioeng. 83, 173-178 (1997).
46. R. K. Wells, J. P. S. Badyal, I. W. Drummond, K. S. Robinson and F. J. Street, J. Adhesion Sci.Technol. 7, 1129-1137 (1993).
47. D. J. Upahyay, N.Y. Cui, B. J. Meenan and N. M. D. Brown, J. Phys. D 38, 922-929 (2005).
48. D. Dixon, R. Morrison, P. Lemoine and B. J. Meenan, J. Adhesion Sci. Technol. 22, 717-731(2008).
49. D. Dixon, B. J. Meenan / J. Adhesion Sci. Technol. 26 (2012) 2325-2337 2337