Synthesis of ultraviolet curable encapsulating adhesives and their package applications for organic optoelectronic devices

Solid State Sciences

Volumn 13, Issue 10, 2011, Pages 1889-1895

  Lin, Shih Hsun ^a   Lin, Jian Shian ^b   Chen, Nien Po ^b   Ko, Cheng Hao ^a   Juang, Fuh Shyang ^c   Chung, Ming Hua ^d   Chen, Chen Ming ^d   Liu, Lung Chang ^d  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b YUAN ZE UNIVERSITY   (Taiwan)

^c NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^d INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Encapsulating adhesive; Optoelectronic device; Organic light emitting diode; Organic solar cell; Package

Indexed keywords

ADHESIVES; CURING; ELECTRONIC EQUIPMENT; IRRADIATION; LIGHT EMITTING DIODES; MICROWAVE IRRADIATION; OPTOELECTRONIC DEVICES; ORGANIC LIGHT EMITTING DIODES (OLED); PACKAGING; REFRACTIVE INDEX; SOLAR CELLS;

ADHESIVE STRENGTH; CONVENTIONAL HEATING; HIGH REFRACTIVE INDEX; ORGANIC LIGHT EMITTING DIODES(OLEDS); ORGANIC OPTOELECTRONICS; SYNTHETIC PROCEDURES; ULTRAVIOLET CURABLE; ULTRAVIOLET ILLUMINATION;

ORGANIC SOLAR CELLS;

EID: 84865760715     PISSN: 12932558     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solidstatesciences.2011.08.002     Document Type: Article

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