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Volumn 98, Issue , 2012, Pages 230-233
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Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography
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Author keywords
Flexible electronics; Flexible interconnects; Polymer substrate; Resistivity; Stencil lithography; Tensile stress
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Indexed keywords
CONDUCTIVE WIRES;
ELECTRICAL PARAMETER;
FLEXIBLE INTERCONNECTS;
FLEXIBLE SUBSTRATE;
LATERAL DIMENSION;
MECHANICAL DEFORMATION;
METAL INTERCONNECTS;
MICROMETER RANGES;
POLYMER SUBSTRATE;
REAL APPLICATIONS;
RELAXED STATE;
SEM IMAGING;
STENCIL LITHOGRAPHY;
TEST STRUCTURE;
THIN FILM CONDUCTORS;
THIN FILM SURFACES;
UNIAXIAL TENSILE;
ELECTRIC CONDUCTIVITY;
FLEXIBLE ELECTRONICS;
LITHOGRAPHY;
TENSILE STRESS;
THICKNESS MEASUREMENT;
THIN FILMS;
FILM THICKNESS;
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EID: 84865597276
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2012.07.016 Document Type: Conference Paper |
Times cited : (3)
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References (10)
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