-
2
-
-
56349128237
-
-
JAPIAU 0021-8979,. 10.1063/1.2802284
-
A. P. Micolich, L. L. Bell, and A. R. Hamilton, J. Appl. Phys. JAPIAU 0021-8979 102, 084511 (2007). 10.1063/1.2802284
-
(2007)
J. Appl. Phys.
, vol.102
, pp. 084511
-
-
Micolich, A.P.1
Bell, L.L.2
Hamilton, A.R.3
-
3
-
-
24644507142
-
-
PNASA6 0027-8424,. 10.1073/pnas.0502392102
-
T. Someya, Y. Kato, T. Sekitani, S. Iba, Y. Noguchi, Y. Murase, H. Kawaguchi, and T. Sakurai, Proc. Natl. Acad. Sci. U.S.A. PNASA6 0027-8424 102, 12321 (2005). 10.1073/pnas.0502392102
-
(2005)
Proc. Natl. Acad. Sci. U.S.A.
, vol.102
, pp. 12321
-
-
Someya, T.1
Kato, Y.2
Sekitani, T.3
Iba, S.4
Noguchi, Y.5
Murase, Y.6
Kawaguchi, H.7
Sakurai, T.8
-
4
-
-
31144477063
-
-
APPLAB 0003-6951,. 10.1063/1.2166488
-
M.-M. Ling, Z. Bao, and D. Li, Appl. Phys. Lett. APPLAB 0003-6951 88, 033502 (2006). 10.1063/1.2166488
-
(2006)
Appl. Phys. Lett.
, vol.88
, pp. 033502
-
-
Ling, M.-M.1
Bao, Z.2
Li, D.3
-
5
-
-
38649108217
-
-
THSFAP 0040-6090,. 10.1016/j.tsf.2007.03.157
-
E. Orgiu, I. Manunza, M. Sana, P. Cosseddu, and A. Bonfiglio, Thin Solid Films THSFAP 0040-6090 516, 1533 (2008). 10.1016/j.tsf.2007.03.157
-
(2008)
Thin Solid Films
, vol.516
, pp. 1533
-
-
Orgiu, E.1
Manunza, I.2
Sana, M.3
Cosseddu, P.4
Bonfiglio, A.5
-
6
-
-
0037245896
-
-
JAPIAU 0021-8979,. 10.1063/1.1525068
-
D. Knipp, R. A. Street, A. Völkel, and J. Ho, J. Appl. Phys. JAPIAU 0021-8979 93, 347 (2003). 10.1063/1.1525068
-
(2003)
J. Appl. Phys.
, vol.93
, pp. 347
-
-
Knipp, D.1
Street, R.A.2
Völkel, A.3
Ho, J.4
-
7
-
-
0141792388
-
-
JAPLD8 0021-4922,. 10.1143/JJAP.42.L967
-
T. Yasuda, K. Fujita, H. Nakashima, and T. Tsutsui, Jpn. J. Appl. Phys., Part 2 JAPLD8 0021-4922 42, L967 (2003). 10.1143/JJAP.42.L967
-
(2003)
Jpn. J. Appl. Phys., Part 2
, vol.42
, pp. 967
-
-
Yasuda, T.1
Fujita, K.2
Nakashima, H.3
Tsutsui, T.4
-
8
-
-
27744586557
-
-
JAPIAU 0021-8979,. 10.1063/1.2076429
-
C. R. Newman, R. J. Chesterfield, M. J. Panzer, and C. D. Frisbie, J. Appl. Phys. JAPIAU 0021-8979 98, 084506 (2005). 10.1063/1.2076429
-
(2005)
J. Appl. Phys.
, vol.98
, pp. 084506
-
-
Newman, C.R.1
Chesterfield, R.J.2
Panzer, M.J.3
Frisbie, C.D.4
-
9
-
-
33645365207
-
-
SMOABF 1744-683X,. 10.1039/b516741h
-
J. Genzer and J. Groenewold, Soft Matter SMOABF 1744-683X 2, 310 (2006). 10.1039/b516741h
-
(2006)
Soft Matter
, vol.2
, pp. 310
-
-
Genzer, J.1
Groenewold, J.2
-
10
-
-
36048935586
-
-
PRBMDO 0163-1829,. 10.1103/PhysRevB.76.205203
-
S. Haas, B. Batlogg, C. Besnard, M. Schiltz, C. Kloc, and T. Siegrist, Phys. Rev. B PRBMDO 0163-1829 76, 205203 (2007). 10.1103/PhysRevB.76.205203
-
(2007)
Phys. Rev. B
, vol.76
, pp. 205203
-
-
Haas, S.1
Batlogg, B.2
Besnard, C.3
Schiltz, M.4
Kloc, C.5
Siegrist, T.6
-
11
-
-
27344438744
-
-
APPLAB 0003-6951,. 10.1063/1.2120894
-
K. Tsukagoshia, I. Yagi, K. Shigeto, and K. Yanagisawa, Appl. Phys. Lett. APPLAB 0003-6951 87, 183502 (2005). 10.1063/1.2120894
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 183502
-
-
Tsukagoshia, K.1
Yagi, I.2
Shigeto, K.3
Yanagisawa, K.4
-
12
-
-
33644525617
-
-
APPLAB 0003-6951,. 10.1063/1.2178213
-
L. Zhou, A. Wanga, S.-C. Wu, J. Sun, S. Park, and T. N. Jackson, Appl. Phys. Lett. APPLAB 0003-6951 88, 083502 (2006). 10.1063/1.2178213
-
(2006)
Appl. Phys. Lett.
, vol.88
, pp. 083502
-
-
Zhou, L.1
Wanga, A.2
Wu, S.-C.3
Sun, J.4
Park, S.5
Jackson, T.N.6
-
13
-
-
45749136355
-
-
APPLAB 0003-6951,. 10.1063/1.2948862
-
C. Yang, J. Yoon, S. H. Kim, K. Hong, D. S. Chung, K. Heo, C. E. Park, and M. Ree, Appl. Phys. Lett. APPLAB 0003-6951 92, 243305 (2008). 10.1063/1.2948862
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 243305
-
-
Yang, C.1
Yoon, J.2
Kim, S.H.3
Hong, K.4
Chung, D.S.5
Heo, K.6
Park, C.E.7
Ree, M.8
-
14
-
-
68349105869
-
-
THSFAP 0040-6090,. 10.1016/j.tsf.2009.02.088
-
D. Simeone, S. Cipolloni, L. Mariucci, M. Rapisarda, A. Minotti, A. Pecora, M. Cuscuǹ, L. Maiolo, and G. Fortunato, Thin Solid Films THSFAP 0040-6090 517, 6283 (2009). 10.1016/j.tsf.2009.02.088
-
(2009)
Thin Solid Films
, vol.517
, pp. 6283
-
-
Simeone, D.1
Cipolloni, S.2
Mariucci, L.3
Rapisarda, M.4
Minotti, A.5
Pecora, A.6
Cuscuǹ, M.7
Maiolo, L.8
Fortunato, G.9
-
15
-
-
0032672026
-
-
EDLEDZ 0741-3106,. 10.1109/55.767101
-
H. Klauk, D. J. Gundlach, and Thomas N. Jackson, IEEE Electron Device Lett. EDLEDZ 0741-3106 20, 289 (1999). 10.1109/55.767101
-
(1999)
IEEE Electron Device Lett.
, vol.20
, pp. 289
-
-
Klauk, H.1
Gundlach, D.J.2
Jackson, T.N.3
-
16
-
-
0038504996
-
-
APPLAB 0003-6951,. 10.1063/1.1579870
-
H. Klauk, M. Halik, U. Zschieschang, F. Eder, G. Schmid, and C. Dehm, Appl. Phys. Lett. APPLAB 0003-6951 82, 4175 (2003). 10.1063/1.1579870
-
(2003)
Appl. Phys. Lett.
, vol.82
, pp. 4175
-
-
Klauk, H.1
Halik, M.2
Zschieschang, U.3
Eder, F.4
Schmid, G.5
Dehm, C.6
|