Evaluation of effectiveness of conformal coatings as tin whisker mitigation

Journal of Electronic Materials

Volumn 41, Issue 9, 2012, Pages 2508-2518

  Han, Sungwon ^a   Osterman, Michael ^a   Meschter, Stephan ^b   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b BAE SYSTEMS   (United States)

Author keywords

coating coverage; conformal coating; Tin whisker

Indexed keywords

BACKSCATTERED ELECTRON MODES; COATING COVERAGE; CONFORMAL COATINGS; CORROSIVE GAS; ELECTRONIC PRODUCT; ELEVATED TEMPERATURE; MITIGATION STRATEGY; PARYLENE C; QUAD FLAT PACKAGE; QUANTITATIVE IMAGE ANALYSIS; TEMPERATURE CYCLING; THIN COATING; TIN WHISKER; UNIFORM COVERAGE;

COATINGS; SCANNING ELECTRON MICROSCOPY; TIN;

CRYSTAL WHISKERS;

EID: 84865218399     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2179-2     Document Type: Article

References (25)

1. S. Ganesan and M. Pecht, Lead-Free Electronics (New York: Wiley Interscience, 2006).
2. B Dunn 1976 Circuit World 2 32 10.1108/eb043543
3. J. Brusse, G. Ewell, and J. Siplon, Proceedings of 22nd Capacitor Resistor Technology Symposium (New Orleans, LA, Mar 2002), pp. 67-80.
4. K. Cunningham and M. Donahue, Proceedings of the 4th International SAMPE Electronics Conference (Albuquerque, NM, June 1990), pp. 569-575.
5. G Sears 1955 Acta Metall. 3 367 10.1016/0001-6160(55)90042-0 1:CAS:528:DyaG2MXns1ajsQ%3D%3D
6. S Arnold 1966 Plating 53 96 1:CAS:528:DyaF28XjvF2rtg%3D%3D
7. J. Brusse, Proceedings of AESF SUR/FIN (Orlando, FL, June 2002), pp. 45-61.
8. L. Corbid, Proceeding of 3rd International SAMPE Electronic Conference (Los Angeles, CA, June 1989), pp. 773-779.
9. B. Nordwall, Aviation Week Space Technol. (1986), pp. 65-70.
10. H. Leidecker, J. Brusse, M. Sampson and J. Kadesch, NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage, http://nepp.nasa.gov/whisker/. Accessed 14 Mar (2012).
11. M. Pecht, Contamination of Electronic Assemblies (Boca Raton: CRC Press, 2003).
12. S Zhan M Azarian M Pecht 2006 J. IEEE Trans. Electron. Packag. Manuf. 29 217 10.1109/TEPM.2006.882496
13. T Fang M Osterman S Mathew M Pecht 2007 Circuit World 32 25 10.1108/03056120610663371
14. M. McDowell (Presented at the Aerospace Applications Conference, Steamboat Springs, CO, 1993).
15. GEIA-STD-0005-2, GEIA, June (2006).
16. E. Russick and G. Thayer, SAND 2008-1125 Report (Sandia National Laboratories, Albuquerque, NM, 2008).
17. L Zakraysek 1977 Plat. Surf. Finish. 64 38 1:CAS:528:DyaE2sXksF2qs70%3D
18. J. Kadesch and J. Brusse, NASA's EEE Links Newsletter, July (2001).
19. J. Kadesch and H. Leidecker, 37th Nordic annual conference (Helsingor, 2000).
20. T. Woodrow and E. Ledbury (Presented at the IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, 2005).
21. T. Woodrow and E. Ledbury (Presented at the SMTA International Conference, Rosemont, IL, 2006).
22. IPC-CC-830B, Qualification and Performance of Electrical Insulating Compouns for Printed Wiring Assemblies (2008).
23. IPC J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies (2010).
24. IPC-A-610E, Acceptability of Electronic Assemblies (2010).
25. ANSI/IPC-2221, Generic Standard on Printed Board Design (1998).