Flower-like CuO nanostructures for enhanced boiling

Nanoscale and Microscale Thermophysical Engineering

Volumn 16, Issue 3, 2012, Pages 145-153

  Im, Yunhyeok ^a   Dietz, Carter ^b   Lee, Seung S ^b   Joshi, Yogendra ^b,c  

^a SAMSUNG Electronics   (South Korea)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

boiling enhancement; flower like CuO; nanostructures; thermal management

Indexed keywords

BOILING ENHANCEMENT; CUO NANOSTRUCTURES; FLOWER-LIKE CUO; MICRO-SCALES; MICROFABRICATED; MICROGROOVED SURFACE; NANO SCALE; NUCLEATE POOL BOILING; ONLINE EDITIONS; ROOM TEMPERATURE; SMOOTH SURFACE; THERMOPHYSICAL ENGINEERING; WICKING;

PHASE TRANSITIONS; TEMPERATURE CONTROL;

NANOSTRUCTURES;

EID: 84864972670     PISSN: 15567265     EISSN: None     Source Type: Journal    
DOI: 10.1080/15567265.2012.678564     Document Type: Article

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