Enhanced nucleate boiling on copper micro-porous surfaces

International Journal of Multiphase Flow

Volumn 36, Issue 10, 2010, Pages 780-792

  El Genk, Mohamed S ^a   Ali, Amir F ^a  

^a MSC01 1070   (United States)

Author keywords

Dendrites micro structure; Dielectric liquids; Electrochemical deposition; Immersion cooling of electronics; Micro porous; Nucleate boiling enhancement

Indexed keywords

BOILING INCIPIENCE; CU SUBSTRATE; DENDRITES MICRO-STRUCTURE; ELECTROCHEMICAL DEPOSITION; ELECTROCHEMICAL PROCESS; IMMERSION COOLING; IMMERSION COOLING OF ELECTRONICS; PLANE SURFACES; POOL BOILING CURVES; POROUS SURFACE; PRESENT VALUE; STRUCTURED SURFACES; SURFACE LAYERS; TEMPERATURE EXCURSIONS; THICK LAYERS; TWO STAGE;

DENDRITES (METALLOGRAPHY); ELECTRODEPOSITION; NEURONS; NUCLEATE BOILING; REDUCTION; TABLE LOOKUP;

DIELECTRIC LIQUIDS;

EID: 77955513127     PISSN: 03019322     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmultiphaseflow.2010.06.003     Document Type: Article

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