High temperature reliability investigations of EEPROM memory cells realised in silicon-on-insulator (SOI) technology

Proceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011

Volumn , Issue , 2011, Pages 221-225

  Grella, K ^a   Vogt, H ^a   Paschen, U ^a  

^a FRAUNHOFER INSTITUTE FOR MICROELECTRONIC CIRCUITS AND SYSTEMS   (Germany)

Author keywords

Data retention; EEPROM; Endurance; High temperature; Reliability; SOI

Indexed keywords

DATA RETENTION; EEPROM; ELECTROMIGRATION RELIABILITY; HIGH TEMPERATURE; HIGH-TEMPERATURE ELECTRONICS; MICROELECTRONIC MANUFACTURING; SILICONON-INSULATOR TECHNOLOGY (SOI); SOI;

CMOS INTEGRATED CIRCUITS; DURABILITY; HIGH TEMPERATURE APPLICATIONS; MICROELECTRONICS; SILICON WAFERS;

RELIABILITY;

EID: 84864443475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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