SCOPUS 정보 검색 플랫폼

Lab on a Chip

Volumn 12, Issue 16, 2012, Pages 2970-2976

UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration

(3) Langelier, Sean M b Yeo, Leslie Y a Friend, James a,b

a RMIT UNIVERSITY (Australia)

b MELBOURNE CENTRE FOR NANOFABRICATION (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE AGENT; EPOXY RESIN; LITHIUM; LITHIUM NIOBATE; SILICON; STARCH; UNCLASSIFIED DRUG;

ACCURACY; ARTICLE; CHEMICAL BOND; ELASTICITY; FORCE; GLASS TRANSITION TEMPERATURE; LAB ON A CHIP; MICROFLUIDICS; NANOFABRICATION; PIEZOELECTRICITY; PRIORITY JOURNAL; ROOM TEMPERATURE; SCANNING ELECTRON MICROSCOPY; SOUND RELATED PHENOMENA; SOUND TRANSMISSION; SURFACE ACOUSTIC WAVE; THICKNESS; ULTRAVIOLET RADIATION; VISCOSITY;

EID: 84864270959 PISSN: 14730197 EISSN: 14730189 Source Type: Journal
DOI: 10.1039/c2lc40085e Document Type: Article

Times cited : (66)

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