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Volumn 10, Issue 16, 2010, Pages 2115-2121
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Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive
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Author keywords
[No Author keywords available]
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Indexed keywords
ACID;
ADHESIVE AGENT;
BASE;
BUFFER;
GLASS;
ORGANIC SOLVENT;
ARTICLE;
DEVICE;
EQUIPMENT DESIGN;
LAB ON A CHIP;
LOW TEMPERATURE;
MICROCHIP ANALYSIS;
MICROELECTROMECHANICAL SYSTEM;
MICROFLUIDICS;
PRIORITY JOURNAL;
TECHNIQUE;
THICKNESS;
ULTRAVIOLET RADIATION;
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EID: 77954970052
PISSN: 14730197
EISSN: 14730189
Source Type: Journal
DOI: 10.1039/c004436a Document Type: Article |
Times cited : (52)
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References (36)
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