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Journal of Materials Chemistry

Volumn 22, Issue 32, 2012, Pages 16484-16490

Enhancement in thermoelectric performance of bismuth telluride based alloys by multi-scale microstructural effects

(7) Hu, Lipeng a Gao, Hongli a Liu, Xiaohua a Xie, Hanhui a Shen, Junjie a Zhu, Tiejun a,b Zhao, Xinbing a

a ZHEJIANG UNIVERSITY (China)

b ZHEJIANG UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANTI-SITE DEFECT; ATOMIC SCALE; BISMUTH TELLURIDE; BULK MATERIALS; DEFORMATION TEMPERATURES; ELECTRICAL CONDUCTIVITY; HOT DEFORMATION PROCESS; IN-PLANE LATTICES; IN-SITU; MICRO-SCALES; MICRO-STRUCTURAL EFFECTS; MULTISCALES; POWER FACTORS; PREFERRED ORIENTATIONS; TEXTURE ENHANCEMENT; THERMOELECTRIC PARAMETERS; THERMOELECTRIC PERFORMANCE; THERMOELECTRIC PROPERTIES;

BISMUTH; BISMUTH COMPOUNDS; ELECTRIC CONDUCTIVITY; ELECTRIC POWER FACTOR; NANOSTRUCTURES; POINT DEFECTS;

THERMOELECTRICITY;

EID: 84864201339 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/c2jm32916f Document Type: Article

Times cited : (123)

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