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Volumn 89, Issue 9, 2001, Pages 5125-5132

Design and fabrication of organic complementary circuits

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0035339596     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1362635     Document Type: Article
Times cited : (164)

References (35)
  • 22
    • 0343382783 scopus 로고    scopus 로고
    • American Society of Mechanical Engineers, (ASME), New York
    • R. W. Filas, Advances in Electronic Packaging (American Society of Mechanical Engineers, (ASME), New York, 1997), Vol. 1, pp. 1265-1282.
    • (1997) Advances in Electronic Packaging , vol.1 , pp. 1265-1282
    • Filas, R.W.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.