A design tradeoff study with monolithic 3D integration

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn , Issue , 2012, Pages 529-536

  Liu, Chang ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3-D INTEGRATION; 3D DESIGN; 3D TECHNOLOGY; DESIGN CHALLENGES; DESIGN STYLES; DESIGN TRADEOFF; GLOBAL VARIATIONS; MONOLITHIC INTEGRATION; PARASITICS; SIGNAL INTEGRITY; TECHNOLOGY IMPROVEMENT; WIRE LENGTH;

COMMERCE; INTEGRATION; MONOLITHIC INTEGRATED CIRCUITS; THREE DIMENSIONAL;

DESIGN;

EID: 84863703091     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2012.6187545     Document Type: Conference Paper

References (11)

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