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Volumn 542, Issue , 2012, Pages 2-5
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Thermal conductivity of tungsten-copper composites
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Author keywords
Differential scanning calorimeter; Laser flash; Nano powder; Thermal conductivity; Tungsten copper composite
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Indexed keywords
COEFFICIENTS OF THERMAL EXPANSIONS;
CONVERSION METHODS;
DIFFERENTIAL SCANNING CALORIMETERS;
HIGH-POWER INTEGRATED CIRCUITS;
LASER FLASH;
METAL INJECTION MOLDING;
NANO POWDERS;
NANO-SIZED;
ROOM TEMPERATURE;
SHIELDING MATERIALS;
TEMPERATURE INCREASE;
TUNGSTEN-COPPER;
TUNGSTEN-COPPER ALLOY;
TUNGSTEN-COPPER COMPOSITES;
W-CU ALLOYS;
COPPER ALLOYS;
COPPER POWDER;
DIFFERENTIAL SCANNING CALORIMETRY;
TUNGSTEN;
TUNGSTEN ALLOYS;
TUNGSTEN COMPOUNDS;
THERMAL CONDUCTIVITY;
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EID: 84863310352
PISSN: 00406031
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tca.2012.03.022 Document Type: Conference Paper |
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Times cited : (72)
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References (13)
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