Erratum: The effects of composition and microstructure on the thermal conductivity of liquid-phase-sintered W-Cu (Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 41A:6 (1564-1572) DOI: 10.1007/s11661-010-0210-x);The effects of composition and microstructure on the thermal conductivity of liquid-phase-sintered W-Cu

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 41, Issue 6, 2010, Pages 1564-1572

  Johnson, John L ^a   Park, Seong Jin ^b   Kwon, Young Sam ^c   German, Randall M ^d  

^a ATI Engineered Products   (United States)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c CetaTech Inc   (South Korea)

^d AGC Paul S Roel Chair in Construction Engineering and Management   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; GRAIN SIZE AND SHAPE; LIQUID PHASE SINTERING; MICROSTRUCTURE; POROSITY; TRANSITION METALS; TUNGSTEN ALLOYS;

COMPUTATIONAL CELL; GRAIN SHAPES; INTERFACIAL RESISTANCES; MATRIX VOLUMES; MODEL PREDICTION; MODEL-BASED OPC; THERMAL BOUNDARY CONDUCTANCE; TRANSITION METAL IMPURITIES;

THERMAL CONDUCTIVITY;

EID: 77952672238     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-010-0312-5     Document Type: Erratum

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