Effect of WC and CeO2 on microstructure and properties of W-Cu electrical contact material

International Journal of Refractory Metals and Hard Materials

Volumn 28, Issue 2, 2010, Pages 305-311

  Yang, Xiaohong ^a   Liang, Shuhua ^a   Wang, Xianhui ^a   Xiao, Peng ^a   Fan, Zhikang ^a  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Arc erosion morphology; Properties; Vacuum electrical breakdown; W Cu alloy; WC or CeO2 addition

Indexed keywords

ARC EROSION; ARC EROSION MORPHOLOGY; BREAKDOWN STRENGTHS; CATHODE SURFACE; CHOPPING CURRENT; CU ALLOY; ELECTRICAL ARC; ELECTRICAL BREAKDOWN; ELECTRICAL BREAKDOWN TEST; ELECTRICAL CONTACT MATERIAL; MICROSTRUCTURE AND PROPERTIES; MOLTEN COPPER;

ALLOYS; CAVITY RESONATORS; COPPER ALLOYS; ELECTRIC BREAKDOWN OF LIQUIDS; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; METALLURGY; MICROSTRUCTURE; MORPHOLOGY; TUNGSTEN ALLOYS; TUNGSTEN CARBIDE; VACUUM;

CERIUM ALLOYS;

EID: 74849101682     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2009.11.009     Document Type: Article

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