Crosstalk analysis of carbon nanotube bundle interconnects

Nanoscale Research Letters

Volumn 7, Issue , 2012, Pages 1-5

  Zhang, Kailiang ^a   Tian, Bo ^a   Zhu, Xiaosong ^a   Wang, Fang ^a   Wei, Jun ^a,b  

^a TIANJIN UNIVERSITY OF TECHNOLOGY   (China)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Bundles; Carbon nanotube; Crosstalk; Interconnects; Simulation

Indexed keywords

ADJACENT LINES; BUNDLES; CARBON NANOTUBE BUNDLE; CARBON NANOTUBES (CNTS); CROSS-TALK PROBLEM; CROSSTALK ANALYSIS; CURRENT CARRYING CAPABILITY; IC TECHNOLOGY; INTERCONNECT MATERIALS; INTERCONNECT PARAMETER; MECHANICAL ROBUSTNESS; NANO SCALE; SIMULATION; SPICE SIMULATORS;

MATERIALS SCIENCE; NANOSTRUCTURED MATERIALS; OPTICAL INTERCONNECTS;

CROSSTALK;

EID: 84863245024     PISSN: 19317573     EISSN: 1556276X     Source Type: Journal    
DOI: 10.1186/1556-276X-7-138     Document Type: Article

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