Carbon-based interconnect: Performance, scaling and reliability of 3D stacked multilayer graphene system

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2011, Pages

  Yu, Tianhua ^c   Kim, Edwin ^a   Jain, Nikhil ^a   Xu, Yang ^b   Geer, Robert ^a   Yu, Bin ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b ZHEJIANG UNIVERSITY   (China)

^c NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON-BASED; DIRAC POINT; ELECTRICAL CONDUCTION; HIGH-SPEED; MATERIAL CANDIDATE; MATERIAL SYSTEMS; ON-CHIP INTERCONNECTS; PERFORMANCE METRICS; STACKED LAYER; STRESS-INDUCED;

ELECTRON DEVICES; MONOLAYERS; MULTILAYERS; RELIABILITY; THREE DIMENSIONAL; WIRE;

GRAPHENE;

EID: 84863076865     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2011.6131508     Document Type: Conference Paper

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