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Journal of Nanoscience and Nanotechnology

Volumn 11, Issue 2, 2011, Pages 1493-1498

Flexibility of silver conductive circuits screen-printed on a polyimide substrate

(4) Kim, Kwang Seok a Lee, Young Chul a Kim, Jong Woong b Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

b Korea Electronic Technology Institute (KETI) (South Korea)

Author keywords

Ag nanopaste; Flexible electronics; MIT folding endurance test; Screen printing; Sintering condition

Indexed keywords

DIRECT PRINTING; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL CHARACTERISTIC; ELECTRICAL RESISTANCES; FOLDING ENDURANCE; LOWER SINTERING TEMPERATURES; MASSACHUSETTS INSTITUTE OF TECHNOLOGY; MECHANICAL CHARACTERISTICS; MIT FOLDING ENDURANCE TEST; POLYIMIDE SUBSTRATE; SCREEN PRINTING TECHNIQUE; SCREEN-PRINTED; SINTERING CONDITION; SINTERING TEMPERATURES; SINTERING TIME;

DURABILITY; FLEXIBLE ELECTRONICS; MICROSTRUCTURAL EVOLUTION; POLYIMIDES; SCREEN PRINTING; SINTERING;

SILVER;

EID: 84863011497 PISSN: 15334880 EISSN: None Source Type: Journal
DOI: 10.1166/jnn.2011.3368 Document Type: Conference Paper

Times cited : (21)

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