Surface modification of polyimide films by an ethylenediamine treatment for a flexible copper clad laminate

Macromolecular Research

Volumn 20, Issue 2, 2012, Pages 168-173

  Park, Yun Jun ^a   Yu, Duk Man ^a   Ahn, Jeong Ho ^b   Choi, Jong Ho ^c   Hong, Young Taik ^a  

^a Korea Research Institute of Chemical Technology   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Kyungil University   (South Korea)

Author keywords

adhesion property; ethylenediamine; polyimide film; surface modification

Indexed keywords

ADHESION PERFORMANCE; ADHESION PROPERTIES; AMINO GROUP; CHEMICAL COMPOSITIONS; COPPER LAYER; ETHYLENE DIAMINE; FLEXIBLE COPPER CLAD LAMINATE; IMIDE GROUPS; MODIFICATION METHODS; MODIFIED POLYIMIDES; PEEL STRENGTH; PEEL TESTS; POLYIMIDE FILM;

ADHESION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; COPPER; LAMINATES; POLYMERIC FILMS; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

POLYIMIDES;

EID: 84862921739     PISSN: 15985032     EISSN: 20927673     Source Type: Journal    
DOI: 10.1007/s13233-012-0025-2     Document Type: Article

References (24)

1. R. Flitsch and D. Y. Shin, J. Vac. Sci. Technol. A, 8, 2376 (1990).
2. G. S. Chang, S. M. Jung, Y. S. Lee, I. S. Choi, C. N. Whang, J. J. Woo, and Y. P. Lee, J. Appl. Phys., 81, 135 (1997).
3. C. E. Stoog, Prog. Polym. Sci., 16, 561 (1991).
4. H. Kim and J. Jang, Polymer, 41, 6553 (2000). (Pubitemid 30333277)
5. T. Strunskus and M. Grunze, in Polyimides: Fundamentals and Application, M. K. Ghosh and K. L. Mittal, Eds., Marcel Dekker, New York, 1996, pp 187-204.
6. K. W. Lee and A. Viehbeck, in Polyimides: Fundamentals and Application, M. K. Ghosh and K. L. Mittal, Eds., Marcel Dekker, New York, 1996, pp 505-532.
7. A. S. Mathews and C. S. Ha, Macromol. Res., 15, 114 (2007).
8. E. Liston, L. Martinu, and M. Wertheimer, J. Adhes. Sci. Technol., 7, 1091 (1993).
9. K. W. Lee, S. P. Kowalczuk, and J. M. Shaw, Macromolecules, 23, 2097 (1990).
10. R. R. Thomas, S. L. Buchwalter, L. P. Buchwalter, and T. H. Chao, Macromolecules, 25, 4559 (1992).
11. H. J. Kim, Y. J. Parka, J.-H. Choi, H. S. Han, and Y. T. Hong, J. Ind. Eng. Chem., 15, 23 (2009).
12. N. Inagaki, S. Tasaka, H. Ohmori, and S. Mibu, J. Adhes. Sci. Technol., 10, 243 (1996).
13. G. Rozovskis, J. Vinkevicius, and J. Jaciauskiene, J. Adhes. Sci. Technol., 10, 399 (1996).
14. E. H. Lee, in Polyimides: Fundamentals and Application, M. K. Ghosh and K. L. Mittal, Eds., Marcel Dekker, New York, 1994, pp 471-504.
15. J. W. Shin, J. P. Jeun, and P. H. Kang, Macromol. Res., 18, 227 (2010).
16. H. Esrom, R. Seebock, M. Charbonnier, and M. Romand, Surf. Coat. Technol., 125, 19 (2000). (Pubitemid 30566966)
17. J. W. Choi, K. E. Lee, and T. S. Oh, Mater. Res. Soc. Symp. Proc., 629, 1 (2001).
18. L. J. Matienzo and W. N. Uncrtl, in Polyimides: Fundamentals and Applications, M. K. Ghosh and K. L. Mittal, Eds., Marcel Dekker, New York, 1996, pp 629-696.
19. M. C. Zhang, E. T. Kang, K. G. Neoh, C. Q. Cui, and T. B. Lim, Polymer, 42, 453 (2001).
20. L. L. Lau, Y. Xiong, and L. Hong, in Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, K. L. Mittal, Ed., Brill Academic Publishers, Utrecht, 2003, Part 2, pp 331-344.
21. A. Ektessabi and S. Hakamata, Thin Solid Films, 377, 621 (2000). (Pubitemid 32035282)
22. T. Ramanathan, F. T. Fisher, R. S. Ruoff, and L. C. Brinson, Chem. Mater., 17, 1290 (2005). (Pubitemid 40395695)
23. R. Wenzel, Ind. Eng. Chem., 28, 988 (1936).
24. H. K. Yun, K. Cho, K. Kim, and C. E. Park, Polymer, 38, 827 (1997).