Synthesis and electrical resistivity analysis of ATO-coated talc

Powder Technology

Volumn 224, Issue , 2012, Pages 124-128

  Wang, L S ^a   Lu, H F ^a   Hong, R Y ^a,b,c   Feng, W G ^c  

^a SOOCHOW UNIVERSITY   (China)

^b FUZHOU UNIVERSITY   (China)

^c Nanocom Inc   (China)

Author keywords

Antimony doped tin oxide (ATO); Conductive powders; Resistivity; Talc

Indexed keywords

ANTIMONY-DOPED TIN OXIDE; ANTIMONY-DOPED TIN OXIDE NANOPARTICLES; CALCINATION TEMPERATURE; EFFECT OF PH; ELECTRICAL RESISTIVITY; EXPERIMENTAL CONDITIONS; HYDROLYSIS REACTION; MASS RATIO; SCANNING ELECTRONIC MICROSCOPY;

CALCINATION; ELECTRIC CONDUCTIVITY; HYDROLYSIS; PH EFFECTS; PRECIPITATION (CHEMICAL); SYNTHESIS (CHEMICAL); TALC; THERMOGRAVIMETRIC ANALYSIS; TIN; TIN OXIDES; X RAY DIFFRACTION;

POWDERS;

ANTIMONY CHLORIDE; ANTIMONY DERIVATIVE; ANTIMONY DOPED TIN OXIDE NANOPARTICLE; NANOPARTICLE; TALC; TIN CHLORIDE; UNCLASSIFIED DRUG;

ARTICLE; CALCINATION; CALCINATION TEMPERATURE; CALCINATION TIME; CHEMICAL COMPOSITION; COATING RATIO; CONDUCTIVE POWDER; CONTROLLED STUDY; COPRECIPITATION; COST EFFECTIVENESS ANALYSIS; CRYSTAL STRUCTURE; ELECTRIC RESISTANCE; HIGH TEMPERATURE PROCEDURES; HYDROLYSIS; HYDROLYSIS TEMPERATURE; PARTICLE SIZE; PH; PHYSICAL PARAMETERS; POWDER; PRECIPITATION; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; THERMOGRAVIMETRY; X RAY DIFFRACTION;

EID: 84862807683     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2012.02.039     Document Type: Article

References (24)

1. Pinna N., Neri G., Antonietti M., Niederberger M. Angewandte Chemie International Edition 2004, 43:4345-4349.
2. Harrison P.G., Willet M.J. Nature 1988, 332:337.
3. Mayer J.W., Alford T.L. Journal of Applied Physics 2005, 98:83705-83713.
4. Agashe C., Takwale M.G., Marathe B.R., Bhide V.G. Solar Energy Materials 1988, 17:99.
5. Olive P., Pereira E.C., Longo E., Varella J.A., Bulhoes L.O.D. Journal of the Electrochemical Society 1993, L81:140.
6. Ait Aouaj M., Diaz R., Belayachi A., Rueda F., Abd-Lefdil M. Materials Research Bulletin 2009, 44:1458-1461.
7. Feng X., Ma J., Yang F., Ji F., Zong F., Luan C., Ma H. Materials Letters 2008, 62:1779-1781.
8. Coleman J.P., Lynch A.T., Madhukar P., Wagenknecht J.H. Solar Energy Materials and Solar Cells 1999, 56:375.
9. Li Y.-Q., Wanga J.-L., Fu S.-Y., Mei S.-G., Zhang J.-M., Yong K. Materials Research Bulletin 2010, 45:677-681.
10. Yoshizumi M., Wakabayashi K. Journal of Plastics Engineering 1987, 43:61.
11. Boschloo G., Fitzmaurice D. The Journal of Physical Chemistry. B 1999, 103:3093-3098.
12. Hu P.W., Yang H.M. Applied Clay Science 2010, 48:368-374.
13. Emons T.T., Li J.Q., Nazar L.F. Journal of the American Chemical Society 2002, 124:8516.
14. Hu Y.H., Zhang H.H., Yang H.M. Journal of Alloys and Compounds 2008, 453:292-297.
15. Sladkevich S., Mikhaylov A.A., Prikhodchenko P.V., Tripol'skaya T.A., Lev O. Inorganic Chemistry 2010, 49:9110-9112.
16. Letaïef S., Aranda P., Ruiz-Hitzky E. Applied Clay Science 2005, 28:183-198.
17. Outemzabet R., Bouras N., Kesri N. Thin Solid Films 2007, 515:6518-6520.
18. Lee P.-S., Lin Y.-H., Chang Y.-S., Wu J.-M., Shih H.C. Thin Solid Films 2010, 519:1749-1754.
19. Jeona H.-J., Jeona M.-K., Kang M., Lee S.-G., Lee Y.-L., Hong Y.-K., Choi B.-H. Materials Letters 2005, 59:1801-1810.
20. Feng X.J., Ma J., Yang F., et al. Materials Letters 2008, 62:1779-1781.
21. Yao C., Wu F., Non-Met J. Mines 2003, 26:15-18.
22. Mishra K.C., Johnson K.H., Shimidt P.C. Physical Review B 1995, 51:13972.
23. Elangovan E., Ramamurthi K. Applied Surface Science 2005, 249:183-196.
24. Müller V., Rasp M., Stefanic G., Ba J., Gunther S., Rathousky J., Niederberger M., Fattakhova-Rohlfing D. Chemistry of Materials 2009, 21:5229-5236.