Wetting and oxidation during ultrasonic soldering of an alumina reinforced aluminum-copper-magnesium (2024 Al) matrix composite

Composites Part A: Applied Science and Manufacturing

Volumn 43, Issue 3, 2012, Pages 407-414

  Xu, Zhiwu ^a   Ma, Lin ^a   Yan, Jiuchun ^a   Yang, Shiqin ^a   Du, Shanyi ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

A. Aluminum matrix composites; B. Wettability; E. Joints joining; Ultrasonic vibration

Indexed keywords

AIR ATMOSPHERE; AL-CU ALLOYS; ALUMINUM MATRIX COMPOSITES; BASE METALS; CERAMIC PARTICLE; E. JOINTS/JOINING; JOINT STRENGTH; LIQUID FILLER; MATRIX COMPOSITE; NON-WETTING; PARTIAL MELTING; POSSIBLE SOLUTIONS; SOLDERABILITY; ULTRASONIC SOLDERING; ULTRASONIC VIBRATION;

ALUMINA; ALUMINUM ALLOYS; COPPER ALLOYS; FILLERS; MAGNESIUM; METALLIC MATRIX COMPOSITES; OXIDE FILMS; SOLDERING; SOLDERING ALLOYS; ULTRASONIC EFFECTS; ULTRASONIC WAVES; WETTING;

ALUMINUM;

EID: 84862795170     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2011.12.006     Document Type: Article

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