Reliability analyses for new improved high performance flip chip BGA packages

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 695-700

  Chong, D Y R ^a   Goh, K Y ^a   Kapoor, R ^a   Sun, A Y S ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; RELIABILITY; SOLDERED JOINTS;

FLIP CHIP INTERCONNECTS; HIGH-PERFORMANCE IC; PACKAGE RELIABILITY; PACKAGE SUBSTRATES; SOLDER JOINT RELIABILITY; STRUCTURAL DIFFERENCES; THERMAL DISSIPATION; THERMAL LOADINGS;

CHIP SCALE PACKAGES;

EID: 84862480766     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271608     Document Type: Conference Paper

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