Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique

Journal of Materials Processing Technology

Volumn 212, Issue 10, 2012, Pages 2066-2073

  Luo, Jun ^a,b   Qi, Le Hua ^a,b   Zhong, Song Yi ^a   Zhou, Ji Ming ^a,b   Li, He Jun ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Data driven soldering; Drop on demand (DOD); Interconnects; Uniform droplets

Indexed keywords

CAPILLARY FORCE; COPPER CABLES; COPPER SUBSTRATES; DEPOSITION TECHNOLOGY; DROP-ON-DEMAND; DROPLET SPREADING; DROPLET TEMPERATURE; DROPLET VELOCITY; FLEXIBLE CIRCUIT; IMPACT VELOCITIES; INITIAL PARAMETER; MICRO DEVICES; MICRO-ELECTRONIC DEVICES; SOLDER DEPOSITION; SUBSTRATE TEMPERATURE; UNIFORM DROPLET;

COPPER; OPTICAL INTERCONNECTS; PNEUMATICS; SOLDERING;

DROPS;

EID: 84862126154     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2012.05.007     Document Type: Article

References (22)

1. N. Arun Kumar, and C. Ting A method for improved VCSEL packaging using MEMS and ink-jet technologies Journal of Lightwave Technology 24 2006 1504 1512
2. D. Attinger, Z. Zhao, and D. Poulikakos An experimental study of molten microdroplet surface deposition and solidification: transient behavior and wetting angle dynamics Transactions of the ASME 122 2000 544 556
3. R.G. Azar, Z. Yang, S. Chandra, and J. Mostaghimi Impact of molten metal droplets on the tip of a pin projecting from a flat surface International Journal of Heat and Fluid Flow 26 2005 334 347 (Pubitemid 40262977)
4. S.X. Cheng, T. Li, and S. Chandra Producing molten metal droplets with a pneumatic droplet-on-demand generator Journal of Materials Processing Technology 159 2005 295 302 (Pubitemid 40072598)
5. G.M. Duthaler Design of a Droplet-on-Demand Delivery System for Molten Solder Microps 1992 Massachusetts Institute of Technology, M1 - Master Boston
6. K.-C. Fan, J.-Y. Chen, H. Ching, and W.-C. Pan Development of a drop-on-demand droplet generator for one-drop-fill technology Sensors and Actuators A 147 2008 649 655
7. X.W. Fu, and J.S. Zhang Modeling and optimizing software of spray deposition process Acta Metallurgica 35 1999 147 151
8. K.K.B. Hon, L. Li, and I.M. Hutchings Direct writing technology - advances and developments CIRP Annals - Manufacturing Technology 57 2008 601 620
9. W.K. Hsiao Effects of Surface Properties on Solder Bump Formation by Direct Droplet Deposition 2004 Massachusetts Institute of Technology, M1 - Doctor MA pp. 10-13
10. P.S. Grant, B. Cantor, and L. Katgerman Modelling of droplet dynamic and thermal histories during spray forming - I. Individual droplet behaviour Acta Metallurgica et Materialia 41 11 1993 3097 3108
11. A. Jeang, and H.-C. Li An empirical study on the robust design of a semiconductor-bumping process Journal of Materials Processing Technology 209 2009 2986 2993
12. G. Kumar, and K.N. Prabhu Review of non-reactive and reactive wetting of liquids on surfaces Advances in Colloid and Interface Science 2007 61 89 (Pubitemid 47320607)
13. T.-M. Lee, T.G. Kang, J.-S. Yang, J. Jo, K.-Y. Kim, B.-O. Choi, and D.-S. Kim Drop-on-demand solder droplet jetting system for fabricating microstructure IEEE Transactions on Electronics Packaging Manufacturing 31 2008 202 210
14. Q. Liu, and M. Orme High precision solder droplet printing technology and the state-of-the-art Journal of Materials Processing Technology 115 2001 271 283 (Pubitemid 32932963)
15. W. Liu, C. Wang, Y. Tian, and M. Li Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process Journal of Alloys and Compounds 458 2008 323 329 (Pubitemid 351621049)
16. J. Luo, L.-H. Qi, X.-S. Jiang, J.-M. Zhou, and H. Huang Research on lateral instability of the uniform-charged droplet stream during droplet-based freeform fabrication International Journal of Machine Tools and Manufacture 48 2008 289 294
17. J. Luo, L.-H. Qi, J.-M. Zhou, Y. Xiao, and F. Yang Study on stable delivery of charged uniform droplets for freeform fabrication of metal parts Science CHINA Technological Sciences 54 7 2011 1833 1840
18. M. Orme, J. Courter, Q.B. Liu, C.Z. Huang, and R. Smith Electrostatic charging and deflection of nonconventional droplet streams formed from capillary stream breakup Physics of Fluids 12 2000 2224 2235
19. L.-H. Qi, X.-S. Jiang, J. Luo, H. Xianghui, and L. Hejun Dominant factors of metal jet breakup in micro droplet deposition manufacturing technique Chinese Journal of Aeronautics 23 2010 495 500
20. L.-H. Qi, J. Luo, J.-M. Zhou, X.-H. Hou, and H.-J. Li Predication and measurement of deflected trajectory and temperature history of uniform metal droplets in microstructures fabrication International Journal of Advanced Manufacturing Technology 55 2011 997 1006
21. S. Schiaffinoa, and A.A. Soninb Molten droplet deposition and solidification at low Weber numbers Physics of Fluids 9 1997 3172 3187
22. H.K. Yeo, and K.H. Han Wetting and spreading of molten SnPb solder on a Cu-10%Nb micro-composite Journal of Alloys and Compounds 477 2009 278 282