On thermo-mechanical reliability of plated-through-hole (PTH)

Microelectronics Reliability

Volumn 52, Issue 6, 2012, Pages 1189-1196

  Su, Fei ^a   Mao, Ronghai ^b   Xiong, Ji ^a   Zhou, Kun ^c   Zhang, Zheng ^a   Shao, Jiang ^d   Xie, Cunyi ^e  

^a BEIHANG UNIVERSITY   (China)

^b ALSTOM SWITZERLAND LTD   (Switzerland)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d China Aero Polytechnology Establishment   (China)

^e AGILENT TECHNOLOGIES   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONTROL VARIABLE; ELECTRICAL RESISTANCES; FAILURE CRITERIA; FATIGUE LIFE PREDICTION MODELS; NANOINDENTERS; STRAIN VARIATION; THERMAL CYCLE; THERMO-MECHANICAL ANALYZER; THERMOMECHANICAL RELIABILITY; TOTAL STRAIN AMPLITUDE; WEIBULL STATISTICS;

COMPUTER SIMULATION; COPPER; FATIGUE DAMAGE; FATIGUE TESTING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; ORGANIC POLLUTANTS; WEIBULL DISTRIBUTION;

PRINTED CIRCUIT BOARDS;

EID: 84861531591     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.11.021     Document Type: Article

References (15)

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