Reliability of high aspect ratio plated through holes (PTH) for advanced printed circuit board (PCB) packages

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1997, Pages 129-135

  Goyal, Deepak ^a   Azimi, Hamid ^a   Chong, Kim Poh ^a   Lii, Mirng Ji ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CRACK INITIATION; RELIABILITY; THERMAL CYCLING; THERMAL EFFECTS; THERMAL STRESS;

BARREL CRACKING; PLATED THROUGH HOLES (PTH);

PRINTED CIRCUIT BOARDS;

EID: 0030704126     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)