Extracting the electromechanical coupling constant of piezoelectric thin film by the high-tone bulk acoustic resonator technique

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 59, Issue 5, 2012, Pages 958-962

  Zhou, Chong ^a   Pang, Wei ^a   Li, Qiang ^a   Yu, Hongyu ^b   Hu, Xiaotang ^a   Zhang, Hao ^a  

^a TIANJIN UNIVERSITY   (China)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALN; DEPOSITION CONDITIONS; HIGH-TONE BULK ACOUSTIC RESONATORS; IMPEDANCE RESPONSE; MASS PRODUCTION; MATERIAL PROPERTY; PIEZOELECTRIC FILM; PIEZOELECTRIC THIN FILMS; REAL TIME QUALITY CONTROL; THIN FILM PIEZOELECTRIC;

ACOUSTIC RESONATORS; ELECTROMECHANICAL COUPLING; FILM GROWTH; PIEZOELECTRIC MATERIALS; PIEZOELECTRICITY; SILICON WAFERS; THIN FILMS;

VAPOR DEPOSITION;

EID: 84861500450     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2012.2280     Document Type: Article

References (9)

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