Non-destructive inspection of through mould vias in stacked embedded packages by micro-CT

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 710-713

  Roth, Holger ^a   Neubrand, Tobias ^b  

^a Application Laboratory Stuttgart   (Germany)

^b GE Sensing and Inspection Technologies GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BGA SOLDER JOINTS; COMPUTED TOMOGRAPHY; MICRO CT; MICRON RESOLUTION; NON DESTRUCTIVE INSPECTION;

ELECTRONICS PACKAGING; MOLDS; NONDESTRUCTIVE EXAMINATION;

COMPUTERIZED TOMOGRAPHY;

EID: 84860898646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184511     Document Type: Conference Paper

References (6)

1. Braun,T., Becker K.-F.,Voges, S., Thomas, T, Kahle, R., Bader V., Bauer, J., Piefke K., Krüger R., Aschenbrenner R., Lang K.-D., Through Mold Vias for Stacking of Mold Embedded Packages, ECTC 2011, Lake Buena Vista
2. H. Roth et al., Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-Ray Tubes and NanoCT, 10th Electronics Packaging Technology Conference, Singapore 2008
3. H. Roth et al., Inspection of TSV and Other Interconnections in IC Packages by Computed Tomography, 11th Electronics Packaging Technology Conference, Singapore 2009
4. H. Roth, Tobias Neubrand, and Thomas Mayer, Improved Inspection of Miniaturised Interconnections by Digital X-ray Inspection and Computed Tomography, 12th Electronics Packaging Technology Conference, Singapore 2010
5. Wolter, Klaus-Jürgen, Oppermann, Martin and Zerna, Thomas, "Nano Packaging - A Challenge for Nondestructive Testing", 10th Electronics Packaging Technology Conference, Singapore 2008
6. Brunke, Oliver, et al. "Comparison between X-ray tube based and synchrotron radiation based μCT", Proc. Developments in X-ray Tomography, SPIE Int. Symposion of Opical Engineering & Applications, San Diego, CA, Aug. 2008, Proc. of SPIE Vol. 7078