Improved inspection of miniaturised interconnections by digital X-ray inspection and computed tomography

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 441-444

  Roth, Holger ^a   Neubrand, Tobias ^b   Mayer, Thomas ^b  

^a General Electric Sensing and Inspection Technologies GmbH   (Germany)

^b GE Sensing and Inspection Technologies GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTED TOMOGRAPHY; DIGITAL X-RAY IMAGING; EMBEDDED DEVICE; MICROVIAS; NANO-FOCUS; THREE DIMENSIONS; VIA FILL; X RAY INSPECTION;

COMPUTERIZED TOMOGRAPHY; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; X RAY ANALYSIS; X RAYS;

INSPECTION;

EID: 79951862814     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702680     Document Type: Conference Paper

References (4)

1. Wolter, Klaus-Jürgen, Oppermann, Martin and Zerna, Thomas, "Nano Packaging - A Challenge for Nondestructive Testing", 10th Electronics Packaging Technology Conference, Singapore 2008
2. H. Roth et al., Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-Ray Tubes and NanoCT, 10th Electronics Packaging Technology Conference, Singapore 2008
3. H. Roth et al., Inspection of TSV and Other Interconnections in IC Packages by Computed Tomography, 11th Electronics Packaging Technology Conference, Singapore 2009
4. Brunke, Oliver, et al. "Comparison between X-ray tube based and synchrotron radiation based μCT", Proc. Developments in X-ray Tomography, SPIE Int. Symposion of Opical Engineering & Applications , San Diego, CA, Aug. 2008