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Volumn , Issue , 2011, Pages 48-54
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Through mold vias for stacking of mold embedded packages
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D INTEGRATION;
ACTIVE COMPONENTS;
ARRAY PACKAGES;
BGA PACKAGE;
DAISY CHAIN STRUCTURE;
ELECTRICAL TESTS;
EMBEDDED COMPONENTS;
EPOXY MOLDING COMPOUNDS;
FILLER PARTICLES;
HETEROGENEOUS SYSTEMS;
INTEGRATION PROCESS;
LARGE-AREA PROCESSING;
LASER DRILLING;
LOW COST APPLICATIONS;
LOW COSTS;
MANUFACTURING TECHNOLOGIES;
MECHANICAL DRILLING;
MOLDING COMPOUND;
MOLDING PROCESS;
MULTI-CHIP;
ON-WAFER;
PACKAGING TECHNOLOGIES;
PACKAGING TRENDS;
PCB PROCESS;
PRINTED CIRCUIT BOARD MANUFACTURING;
PROCESS CHAIN;
PROCESS FLOWS;
PROCESSABILITY;
RECTANGULAR AREA;
RESIN COATED COPPER;
SINGLE CHIPS;
STACKED MODULES;
STACKED SYSTEMS;
SYSTEM PACKAGE;
TECHNOLOGY DEMONSTRATORS;
THROUGH-VIAS;
VIA DRILLING;
CHIP SCALE PACKAGES;
COMPRESSION MOLDING;
DIES;
INTEGRATION;
LAMINATING;
LIQUIDS;
MANUFACTURE;
MODIFIED ATMOSPHERE PACKAGING;
MOLDS;
PRINTED CIRCUIT MANUFACTURE;
SHEET MOLDING COMPOUNDS;
SOLDERED JOINTS;
TECHNOLOGY;
PRINTED CIRCUIT BOARDS;
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EID: 79960383972
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2011.5898490 Document Type: Conference Paper |
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Times cited : (36)
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References (6)
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