Inspection of miniaturised interconnections in IC packages with Nanofocus® X-ray tubes and NanoCT

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 644-649

  Roth, H ^a   He, Z ^a   Paul, T ^a  

^a Phoenix/x ray Systems + Services GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON TUBES; ELECTRONICS PACKAGING; FAILURE ANALYSIS; PARTICLE DETECTORS; QUALITY ASSURANCE; SAFETY FACTOR; WIRE; X RAY TUBES;

BOND WIRES; COPPER BONDS; FLIP CHIP SOLDERS; HIGH-RESOLUTION CT; HIGHEST RESOLUTIONS; IC PACKAGES; INSPECTION TOOLS; MICROVIA; NANO FOCUS; NANO-CT;

INSPECTION;

EID: 63049131654     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763506     Document Type: Conference Paper

References (5)

1. Brockdorf, K. et al, "Sub-micron CT: visualization of internal structures" in Developments in X-ray Tomography VI, edited by Stuart Stock, Proceedings of SPIE Vol. 7078, (2008).
2. Japan Inspection Instruments Manufacturers' Association, http://www.j ima.jp
3. Brunke, O. et al. "Comparison between X-ray tube based and synchrotron radiation based μCT", Proc. Developments in X-ray Tomography, SPIE lint. Symposion of Opical Engineering & Applications, San Diego, CA, Aug. 2008, to be published
4. Roth, H., "Hochauflösende Röntgenanalyse und Computertomographie von Lötstellen", GMM-Fachbericht 50, (2006), pp. 285-294
5. Feldkamp, L.A., Davis, L.C., Kress, J.W. "Practical cone beam algorithm", Journal of the Optical Society of America A, 1(6), 612-619 (1984)