|
|
|
Volumn , Issue , 1996, Pages 219-225
|
|
PBGA wire bonding development
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
BONDING;
GLASS TRANSITION;
OPTIMIZATION;
PRINTED CIRCUIT BOARDS;
SHEAR STRESS;
SUBSTRATES;
TEMPERATURE;
THERMAL CONDUCTIVITY;
BOND FORCE;
PLASTIC BALL GRID ARRAY;
THERMOSONIC BONDING;
WIRE BONDING;
ELECTRONICS PACKAGING;
|
|
EID: 0029696692
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
|
Times cited : (40)
|
|
References (5)
|
