Temperature soak reliability of laser-sintered Ag pads for wire bonding

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 397-400

  Yamasaki, Kazuhiko ^a   Maekawa, Katsuhiro ^a   Niizeki, Tomotake ^a   Mita, Mamoru ^b   Matsuba, Yorishige ^c   Terada, Nobuto ^c   Saito, Hiroshi ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b M and M Research Laboratory   (Japan)

^c Harima Chemicals Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

1064 NM; AG NANOPARTICLE; ARGON ATMOSPHERES; AVERAGE DIAMETER; CONTINUOUS WAVES; DRY CONDITION; GOLD WIRE; MAXIMUM POWER OUTPUT; ND : YAG LASERS; PULL STRENGTH; SOLID-PHASE DIFFUSION; WIREBONDING;

BONDING; DEGRADATION; ELECTRIC FURNACES; ELECTRONICS PACKAGING; METALLOGRAPHY; NEODYMIUM LASERS; SINTERING; WIRE;

SILVER;

EID: 84860872053     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184453     Document Type: Conference Paper

References (6)

1. nd Ed.), Wiley-Interscience (New York, 2006), pp. 112-127.
2. th Electronic Components and Technology Conference, Las Vegas, NV, June. 2010, pp. 440-446.
3. th Electronic Components and Technology Conference, San Diego, CA, May. 2009, pp. 1579-1584.
4. th Electronic Components and Technology Conference, Orlando, FL, May. 2008, pp. 950-955.
5. Kajiya, T., Kaneko, D., Doi, M., "Dynamical visualization of "coffee stain phenomenon" in droplets of polymer solution via fluorescent microscopy," Langmuir, Nov. 4, No. 24(21) (2008), pp. 12369-12374.
6. Maekawa, K., Yamasaki, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N., Saito, H., "High-Speed Laser Plating for Wire-Bonding Pad Formation," Transactions of The Japan Institute of Electronics Packaging, Vol. 3, No. 1 (2010), pp. 7-13.