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Volumn 99, Issue 6, 2011, Pages

Functional electroless gold Ohmic contacts in light emitting diodes

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REAGENTS; COLOR DIFFERENCE; ELECTROLESS CHEMICAL DEPOSITION; ELECTROLESS GOLD; ELECTROLESS GOLD PLATING; FORCE GAUGES; GOLD PADS; HIGH ELECTRICAL CONDUCTIVITY; HIGH STABILITY; LONG LIFE; WIRE BONDING;

EID: 84860422145     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3624831     Document Type: Article
Times cited : (2)

References (10)
  • 2
    • 30944460146 scopus 로고    scopus 로고
    • Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
    • DOI 10.1016/j.microrel.2005.06.008, PII S0026271405001393
    • J. W. Kim, D. G. Kim, and S. B. Jung, Microelectron. Reliab. 46, 535 (2006). 10.1016/j.microrel.2005.06.008 (Pubitemid 43109000)
    • (2006) Microelectronics Reliability , vol.46 , Issue.2-4 , pp. 535-542
    • Kim, J.-W.1    Kim, D.-G.2    Jung, S.-B.3
  • 5
    • 32544447943 scopus 로고    scopus 로고
    • 10.1007/BF03215515
    • M. Kato and Y. Okinaka, Gold Bull. 37, 37 (2004). 10.1007/BF03215515
    • (2004) Gold Bull. , vol.37 , pp. 37
    • Kato, M.1    Okinaka, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.