Hybrid cooling technology for large-scale computing systems - From back to the future

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 107-111

  Wei, Jie ^a  

^a Fujitsu Connected Technologies Limited   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AIR CONVECTION; AIR COOLING; AMBIENT AIR; CHILLED WATER; COOLING CAPABILITY; COOLING EFFICIENCY; DESIGN STRATEGIES; DEVICES AND COMPONENTS; FUJITSU; HIGH PERFORMANCE COMPUTING SYSTEMS; HIGH-END SERVERS; HYBRID COOLING; LARGE-SCALE COMPUTING SYSTEMS; LIQUID COOLING; LOW TEMPERATURES; MEMORY MODULES; PACKAGING DENSITY; POWER SUPPLY UNIT; SYSTEM BOARDS; SYSTEM RELIABILITY; TECHNICAL INNOVATION; WATER COOLING; WATER FLOWS;

COMPUTATION THEORY; COOLING; EXHIBITIONS; INNOVATION; TECHNOLOGY;

COOLING SYSTEMS;

EID: 84860351276     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52045     Document Type: Conference Paper

References (9)

1. Wei, J., 2008, "Challenges in Cooling Design of CPU-Packages for High Performance Servers," Heat Transfer Engineering, Vol. 29, No. 2, pp. 178-187.
2. Sauciuc, I., Prasher, R., Chang, J. Y., Erturk, H., Chrysler, G, Chiu, C. P. and Mahajan, R., 2005, "Thermal Performance and Key Challenges for Future CPU Cooling Technologies, Proc. InterPACK'05, San Francisco, USA
3. Mukhopadhyay, S., Raychowdhury, A. and Roy, K., 2003, "Accurate Estimation of Total Leakage Current in Sealed CMOS Logic Circuits Based on Compact Current Modeling," Proc. Design Automation Conf, Anaheim, USA, pp. 169-174.
4. Krishnan, S., Garimella, S. V., Chrysler, G M. and Mahajan, R., 2005, "Towards a Thermal Moore's Law," Proc. InterPACK'05, San Francisco, USA.
5. Inoue, A., 2006, "High Performance and High Reliability Technologies of the SPARC64 V/VI," Scientific Computing Forum, the Society of Scientific Systems, Tokyo, Japan.
6. Lall, P., Pecht, M., and Hakim, E., 1997, "Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach," CRC Press.
7. Wei, J., 2007, "Thermal Management of Fujitsu's High-Performance Servers," FUJITSU Sci. Tech. J., Vol. 43, No. 1, pp. 122-129.
8. Wei, J., Suzuki, M., Udagawa, Y. and Yamamoto, H, 2001, "Thermal Management of Multiple MCMs with Low-Temperature Liquid Cooling," Proceedings of InterPACK'01 conference, ASME, Kauai, Hawaii, USA
9. Ellsworth, M. J., Campbell, L. A., Simons, R. E., Iyengar, M. K, Schmidt, R., and Chu, R., 2008, "The Evolution of Water Cooling for IBM Large Server Systems," Proc. ITherm, Orlando, Florida, USA.