Influence of experimental uncertainty on prediction of holistic multi-scale data center energy efficiency

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 553-563

  Breen, Thomas J ^a   Walsh, Ed J ^a   Punch, Jeff ^a   Shah, Amip J ^b   Kumari, Niru ^b   Bash, Cullen E ^b   Heath, Scot ^c   Rubenstein, Brandon ^c  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b HEWLETT PACKARD LABORATORIES   (United States)

^c HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR FLOW; COEFFICIENT OF PERFORMANCE; DATA CENTER ENERGY EFFICIENCIES; DATA CENTERS; DESIGN TRADEOFF; ENERGY MODEL; EXPERIMENTAL ANALYSIS; EXPERIMENTAL DATA; EXPERIMENTAL EVALUATION; EXPERIMENTAL TEST; EXPERIMENTAL UNCERTAINTY; EXPERIMENTAL VALIDATIONS; FLUID TEMPERATURES; HEAT EXCHANGER PERFORMANCE; IT EQUIPMENT; LEGACY DATA; MULTISCALE MODELS; MULTISCALES; OPERATING CONDITION; SETPOINTS; SHARED INFRASTRUCTURE; SYSTEM LEVELS; TEST CHAMBERS;

ENERGY EFFICIENCY; EXHIBITIONS; FLOW RATE;

COMPUTER SIMULATION;

EID: 84860319702     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52141     Document Type: Conference Paper

References (17)

1. Koomey, J. G., 2007. "Estimating total power consumption by servers in the U.S. and the World". Stanford University.
2. Scaramella, J., 2008. "Next-Generation Power and Cooling for Blade Environments". IDC Technical Report 215675.
3. Shah, A., Patel, C, Bash, C, Sharma, R., and Shih, R., 2008. "Impact of rack-level compaction on the data center cooling ensemble". Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
4. Breen, T. J., Walsh, E. J., Punch, J., Shah, A. J., and Bash, C. E., 2010. "From chip to cooling tower data center modeling: Part I Influence of server inlet temperature and temperature rise across cabinet". Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
5. Walsh, E. J., Breen, T. J., Punch, J., Shah, A. J., and Bash, C. E., 2010. "From chip to cooling tower data center modeling: Part II Influence of chip temperature control philosophy". Intersociety Conference on Thermal and Thermome-chanical Phenomena in Electronic Systems.
6. Breen, T. J., Walsh, E. J., Punch, J., Shah, A. J., Bash, C. E., Rubenstein, B., Heath, S., and Kumari, N., 2011. "From chip to cooling tower data centre modelling: Influence of air-stream containment on operating efficiency". ASME/JSME 8th Thermal Engineering Joing Conference (AJTEC 2011)(44091).
7. Breen, T. J., Walsh, E. J., Punch, J., Shah, A. J., Bash, C. E., Rubenstein, B., Heath, S., and Kumari, N., 2011. "From chip to cooling tower data centre modelling: Chip leakage power and it's impact on cooling system efficiency". ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems (InterPACK 2011)(52030).
8. Fontecchio, M., 2007. "ASHRAE to expand recommended data center humidity, temp ranges". TechTarget.com.
9. 42U, 2009. "The data center temperature debate". 42U.com.
10. Dolezalek, H., 2009. "Data Center Temperature Know The Benefits & Risks Of Bumping Up The Heat". Processor.com, 31(9), p. 38.
11. T&D Messtechnik GmbH, 2010. Anemometer DA30. td-tec.de.
12. Shortridge Instruments Inc., 2010. Flowhood CFM-850L backpressure compensated air balance system. short-ridge.com.
13. Sharma, R. K., Bash, C. E., and Patel, C. D., 2002. "Dimensionless parameters for evaluation of thermal design and performance of large-scale data centers". 8th AIAA/ASME Joint Thermophysics and Heat Transfer Conference.
14. Kline, S. J., and McClintock, F. A., 1953. "Describing uncertainties in single-sample experiments". Mechanical Engineering, 75, pp. 3-8.
15. Coleman, H. W., and Steele, W. G., 1989. Experimentation and uncertainty analysis for engineers. Wiley, New York.
16. Kays, W. M., and London, A. L., 1984. Compact Heat Exchangers, 3rd ed. McGraw-Hill, New York.
17. Holman, J. P., 1997. Heat Transfer, 8th ed. McGraw-Hill, New York.