Impact of rack-level compaction on the data center cooling ensemble

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 1175-1182

  Shah, Amip ^a   Patel, Chandrakant ^a   Bash, Cullen ^a   Sharma, Ratnesh ^a   Shih, Rocky ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

Blade servers; Consolidation; Data center; Electronics cooling; Energy efficiency; Thermal management

Indexed keywords

COMPUTER NETWORKS; ELECTRONICS ENGINEERING; ENERGY POLICY; FIGHTER AIRCRAFT; FORMING; THERMOMECHANICAL TREATMENT;

BLADE SERVERS; CONSOLIDATION; DATA CENTER; ELECTRONICS COOLING; ENERGY EFFICIENCY; THERMAL MANAGEMENT;

SATELLITE COMMUNICATION SYSTEMS;

EID: 50949098811     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544394     Document Type: Conference Paper

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