Numerical simulation and experimental verification on thermal performance of a novel fin-plate thermosyphon

Applied Thermal Engineering

Volumn 40, Issue , 2012, Pages 181-188

  Peng, Hao ^a   Ling, Xiang ^a   Li, Juan ^a  

^a NANJING TECH UNIVERSITY   (China)

Author keywords

Cooling performance; Fin plate thermosyphon; Numerical; Serrated fin

Indexed keywords

AIR FLOW VELOCITY; AIR SIDES; COOLING PERFORMANCE; ELECTRONIC DEVICE; EXPERIMENTAL DATA; EXPERIMENTAL VERIFICATION; FIN THICKNESS; FLUENT SOFTWARE; HEAT TRANSFER EFFICIENCY; NUMERICAL; NUMERICAL INVESTIGATIONS; NUMERICAL RESULTS; SERRATED FIN; SERRATED FINS; STRUCTURAL PARAMETER; THERMAL CHARACTERISTICS; THERMAL PERFORMANCE; THERMOSYPHONS; THREE-DIMENSIONAL MODEL;

CAPILLARY FLOW; PLATES (STRUCTURAL COMPONENTS); SIPHONS; THREE DIMENSIONAL;

FINS (HEAT EXCHANGE);

EID: 84857479410     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.01.034     Document Type: Article

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